High-performance heat sinking for VLSI
Work
Year: 1981
Type: article
Source: IEEE Electron Device Letters
Authors David B. Tuckerman, R. F. W. Pease
Cites: 10
Cited by: 4,659
Related to: 10
FWCI: 24.14
Citation percentile (by year/subfield): 99.99
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Sustainable Development Goal Affordable and clean energy
Open Access status: closed