Circuits, interconnections, and packaging for VLSI
Work
Year: 1990
Type: book
Author H. B. Bakoglu
Cites:
Cited by: 1,962
Related to: 20
FWCI: 17.15
Citation percentile (by year/subfield): 97.6
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed